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 Integrated Synthesizer and VCO ADF4360-1
FEATURES
Output frequency range: 2050 MHz to 2450 MHz Divide-by-2 output 3.0 V to 3.6 V power supply 1.8 V logic compatibility Integer-N synthesizer Programmable dual-modulus prescaler 8/9, 16/17, 32/33 Programmable output power level 3-wire serial interface Analog and digital lock detect Hardware and software power-down mode
GENERAL DESCRIPTION
The ADF4360-1 is a fully integrated integer-N synthesizer and voltage controlled oscillator (VCO). The ADF4360-1 is designed for a center frequency of 2250 MHz. In addition, there is a divide-by-2 option available, whereby the user gets an RF output of between 1025 MHz and 1225 MHz. Control of all the on-chip registers is through a simple 3-wire interface. The device operates with a power supply ranging from 3.0 V to 3.6 V and can be powered down when not in use.
APPLICATIONS
Wireless handsets (DECT, GSM, PCS, DCS, WCDMA) Test equipment Wireless LANs CATV equipment
FUNCTIONAL BLOCK DIAGRAM
AVDD DVDD CE RSET
ADF4360-1
MULTIPLEXER REFIN 14-BIT R COUNTER LOCK DETECT CLK DATA LE 24-BIT DATA REGISTER 24-BIT FUNCTION LATCH PHASE COMPARATOR VVCO VTUNE CC CN MUTE MUXOUT
CHARGE PUMP
CP
INTEGER REGISTER VCO CORE OUTPUT STAGE
RFOUTA
13-BIT B COUNTER PRESCALER P/P+1 N = (BP + A) LOAD LOAD 5-BIT A COUNTER
MULTIPLEXER
RFOUTB
DIVSEL = 1
/2
AGND
DGND
CPGND
Figure 1. Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.326.8703 (c) 2003 Analog Devices, Inc. All rights reserved.
04414-0-001
DIVSEL = 2
ADF4360-1 TABLE OF CONTENTS
Specifications..................................................................................... 3 Timing Characteristics..................................................................... 5 Absolute Maximum Ratings............................................................ 6 Transistor Count........................................................................... 6 ESD Caution.................................................................................. 6 Pin Configuration and Functional Descriptions.......................... 7 Typical Performance Characteristics ............................................. 8 Circuit Description........................................................................... 9 Reference Input Section............................................................... 9 Prescaler (P/P + 1)........................................................................ 9 A and B Counters ......................................................................... 9 R Counter ...................................................................................... 9 PFD and Charge Pump................................................................ 9 MUXOUT and Lock Detect...................................................... 10 Input Shift Register..................................................................... 10 VCO ............................................................................................. 10 Output Stage................................................................................ 11 Latch Structure ........................................................................... 12 Control Latch .............................................................................. 16 N Counter Latch......................................................................... 17 R Counter Latch ......................................................................... 17 Applications..................................................................................... 18 Direct Conversion Modulator .................................................. 18 Fixed Frequency LO................................................................... 19 Power-Up..................................................................................... 19 Interfacing ................................................................................... 19 PCB Design Guidelines for Chip-Scale Package.......................... 20 Output Matching ........................................................................ 20 Outline Dimensions ....................................................................... 21 Ordering Guide .......................................................................... 21
REVISION HISTORY
Revision 0: Initial Version
Rev. 0 | Page 2 of 24
ADF4360-1 SPECIFICATIONS1
Table 1. AVDD = DVDD = VVCO = 3.3 V 10%; AGND = DGND = 0 V; TA = TMIN to TMAX, unless otherwise noted.
Parameter REFIN CHARACTERISTICS REFIN Input Frequency REFIN Input Sensitivity REFIN Input Capacitance REFIN Input Current PHASE DETECTOR Phase Detector Frequency2 CHARGE PUMP ICP Sink/Source3 High Value Low Value RSET Range ICP 3-State Leakage Current Sink and Source Current Matching ICP vs. VCP ICP vs. Temperature LOGIC INPUTS VINH,, Input High Voltage VINL, Input Low Voltage IINH/IINL, Input Current CIN, Input Capacitance LOGIC OUTPUTS VOH, Output High Voltage IOH, Output High Current VOL, Output Low Voltage POWER SUPPLIES AVDD DVDD VVCO AIDD4 DIDD4 IVCO4, 5 IRFOUT4 Low Power Sleep Mode4 RF OUTPUT CHARACTERISTICS5 VCO Output Frequency VCO Sensitivity Lock Time6 Frequency Pushing, (Open Loop) Frequency Pulling, (Open Loop) Harmonic Content (Second) Harmonic Content (Third) Output Power5, 7 Output Power Variation VCO Tuning Range B Version 10/250 -3/0 0 to AVDD 5.0 100 8 Unit MHz min/max dBm min/max V max pF max A max MHz max With RSET = 4.7 k. 2.5 0.312 2.7/10 0.2 2 1.5 2 1.5 0.6 1 3.0 DVDD - 0.4 500 0.4 3.0/3.6 AVDD AVDD 10 2.5 24.0 3.5-11.0 7 2050/2450 57 400 6 15 -20 -35 -13/-6 3 1.25/2.5 mA typ mA typ k nA typ % typ % typ % typ V min V max A max pF max V min A max V max V min/V max CMOS output chosen. IOL = 500 A. Conditions/Comments For f < 10 MHz, use dc-coupled CMOS compatible square wave. AC-coupled. CMOS compatible.
1.25 V VCP 2.5 V. 1.25 V VCP 2.5 V. VCP = 2.0 V.
mA typ mA typ mA typ mA typ A typ MHz min/max MHz/V typ s typ MHz/V typ kHz typ dBc typ dBc typ dBm typ dB typ V min/max
ICORE = 15 mA. RF output stage is programmeable.
ICORE = 15 mA. To within 10 Hz of final frequency. Into 2.00 VSWR load.
Programmable in 3 dB steps. Table 7. For tuned loads, see Output Matching section.
Rev. 0 | Page 3 of 24
ADF4360-1
Parameter NOISE CHARACTERISTICS1, 5 VCO Phase Noise Performance8 B Version -110 -130 -141 -172 -163 -147 -81 0.72 -70 Unit dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ Degrees typ dBc typ Conditions/Comments @ 100 kHz offset from carrier @ 1 MHz offset from carrier @ 3 MHz offset from carrier @ 25 kHz PFD frequency @ 200 kHz PFD frequency @ 8 MHz PFD frequency @ 1 kHz offset from carrier 100 Hz to 100 kHz
Synthesizer Phase Noise Floor9
In-Band Phase Noise10, 11 RMS Integrated Phase Error12 Spurious Signals due to PFD Frequency11, 13
1 2 3
Operating temperature range is: -40C to +85C. Guaranteed by design. Sample tested to ensure compliance. ICP is internally modified to maintain constant loop gain over the frequency range. 4 TA = 25C; AVDD = DVDD = VVCO = 3.3 V; P = 32. 5 These characteristics are guaranteed for VCO Core Power = 15 mA. 6 Jumping from 2.05 GHz to 2.45 GHz. PFD frequency = 200 kHz; loop bandwidth = 10 kHz. 7 Using 50 resistors to VVCO, into a 50 load. For tuned loads, see Output Matching section. 8 The noise of the VCO is measured in open-loop conditions. 9 The synthesizer phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20 log N (where N is the N divider value). 10 The phase noise is measured with the EVAL-ADF4360-xEB1 Evaluation Board and the HP8562E Spectrum Analyzer. The spectrum analyzer provides the REFIN for the synthesizer; offset frequency = 1 kHz. 11 fREFIN = 10 MHz; fPFD = 200 kHz; N = 12500; Loop B/W = 10 kHz. 12 fREFIN = 10 MHz; fPFD = 1 MHz; N = 2400; Loop B/W = 25 kHz. 13 The spurious signals are measured with the EVAL-ADF4360-xEB1 Evaluation Board and the HP8562E Spectrum Analyzer. The spectrum analyzer provides the REFIN for the synthesizer; fREFOUT = 10 MHz @ 0 dBm.
Rev. 0 | Page 4 of 24
ADF4360-1 TIMING CHARACTERISTICS
Table 2. AVDD = DVDD = VVCO = 3.3 V 10%; AGND = DGND = 0 V; 1.8 V and 3 V logic levels used; TA = TMIN to TMAX, unless otherwise noted.
Parameter t1 t2 t3 t4 t5 t6 t7 Limit at TMIN to TMAX (B Version) 20 10 10 25 25 10 20 Unit ns min ns min ns min ns min ns min ns min ns min Test Conditions/Comments LE Setup Time DATA to CLOCK Setup Time DATA to CLOCK Hold Time CLOCK High Duration CLOCK Low Duration CLOCK to LE Setup Time LE Pulse Width
t4
CLOCK
t5
t2
DATA DB23 (MSB) DB22
t3
DB2 DB1 (CONTROL BIT C2) DB0 (LSB) (CONTROL BIT C1)
t7
LE
t1
LE
t6
04414-0-002
Figure 2. Timing Diagram
Rev. 0 | Page 5 of 24
ADF4360-1 ABSOLUTE MAXIMUM RATINGS
Table 3. TA = 25C, unless otherwise noted.
Parameter AVDD to GND* AVDD to DVDD VVCO to GND VVCO to AVDD Digital I/O Voltage to GND Analog I/O Voltage to GND REFIN to GND Operating Temperature Range Maximum Junction Temperature CSP JA Thermal Impedance (Paddle Soldered) (Paddle Not Soldered) Lead Temperature, Soldering Vapor Phase (60 sec) Infrared (15 sec)
*GND = AGND = DGND = 0 V.
Rating -0.3 V to +3.9 V -0.3 V to +0.3 V -0.3 V to +3.9 V -0.3 V to +0.3 V -0.3 V to VDD + 0.3 V -0.3 V to VDD + 0.3 V -0.3 V to VDD + 0.3 V 150C 50C/W 88C/W 215C 220C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. This device is a high performance RF integrated circuit with an ESD rating of <1 kV and it is ESD sensitive. Proper precautions should be taken for handling and assembly.
TRANSISTOR COUNT
12543 (CMOS) and 700 (Bipolar)
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. 0 | Page 6 of 24
ADF4360-1 PIN CONFIGURATION AND FUNCTIONAL DESCRIPTIONS
MUXOUT
20
AGND
DVDD
21
CP
CE
24
23
22
CPGND 1 AVDD 2 AGND 3 RFOUTA 4 RFOUTB 5 VVCO 6
PIN 1 IDENTIFIER
19
LE
18 17 16 15 14 13
DATA CLK REFIN DGND CN RSET
ADF4360
TOP VIEW (Not to Scale)
AGND 10
AGND 11
VTUNE 7
AGND 8
AGND 9
CC 12
Figure 3. Pin Configuration
Table 4. Pin Functional Descriptions
Pin No. 1 2 3, 8-11, 22 4 5 6 7 12 13 Mnemonic CPGND AVDD AGND RFOUTA RFOUTB VVCO VTUNE CC RSET Function Charge Pump Ground. This is the ground return path for the charge pump. Analog Power Supply. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the analog ground plane should be placed as close as possible to this pin. AVDD must have the same value as DVDD. Analog Ground. This is the ground return path of the prescaler and VCO. VCO Output. The output level is programmable from -6 dBm to -13 dBm. See the Output Matching section for a description of the various output stages. VCO Complementary Output. The output level is programmable from -6 dBm to -13 dBm. See Output Matching section for a description of the various output stages. Power Supply for the VCO. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the analog ground plane should be placed as close as possible to this pin. VVCO must have the same value as AVDD. Control Input to the VCO. This voltage determines the output frequency and is derived from filtering the CP output voltage. Internal Compensation Node. This pin must be decoupled to ground with a 10 nF capacitor. Connecting a resistor between this pin and CPGND sets the maximum charge pump output current for the synthesizer. The nominal voltage potential at the RSET pin is 0.6 V. The relationship between ICP and RSET is
I CPmax = 11.75 RSET
14 15 16 17 18 19 20 21 23 24
CN DGND REFIN CLK DATA LE MUXOUT DVDD CE CP
With RSET = 4.7 k, ICPMAX = 2.5 mA. Internal Compensation Node. This pin must be decoupled to VVCO with a 10 F capacitor. Digital Ground. Reference Input. This is a CMOS input with a nominal threshold of VDD/2 and a dc equivalent input resistance of 100 k. See Figure 10. This input can be driven from a TTL or CMOS crystal oscillator or it can be ac-coupled. Serial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched into the 24-bit shift register on the CLK rising edge. This input is a high impedance CMOS input. Serial Data Input. The serial data is loaded MSB first with the two LSBs being the control bits. This input is a high impedance CMOS input. Load Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into one of the four latches, and the relevant latch is selected using the control bits. This multiplexer output allows either the lock detect, the scaled RF, or the scaled reference frequency to be accessed externally. Digital Power Supply. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the digital ground plane should be placed as close as possible to this pin. DVDD must have the same value as AVDD. Chip Enable. A logic low on this pin powers down the device and puts the charge pump into three-state mode. Taking the pin high powers up the device depending on the status of the power-down bits. Charge Pump Output. When enabled, this provides ICP to the external loop filter, which in turn drives the internal VCO.
Rev. 0 | Page 7 of 24
04414-0-003
ADF4360-1 TYPICAL PERFORMANCE CHARACTERISTICS
0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 -140 -150 -160 -170 1k
0 -10 -20
OUTPUT POWER (dB)
-30 -40 -50 -60 -70 -80
OUTPUT POWER (dB)
VDD = 3V, VVCO = 3V ICP = 2.5mA PFD FREQUENCY = 200kHz LOOP BANDWIDTH = 10kHz RES. BANDWIDTH = 10Hz VIDEO BANDWIDTH = 10Hz SWEEP = 1.9 SECONDS AVERAGES = 10
1
2 3 4
04414-0-004
-83.0dBc/Hz
-90 -2kHz -1kHz 2250MHz 1kHz 2kHz
10k
100k 1M FREQUENCY OFFSET (Hz)
10M
Figure 7. Close-In Phase Noise at 2250 MHz (200 kHz Channel Spacing)
Figure 4. Open Loop VCO Phase Noise
-70 -75 -80 -85 -90 -95 -100 -105 -110 -115 -120 -125 -130 -135 -140 -145 -150 -155 100
0 -10 -20 VDD = 3V, VVCO = 3V ICP = 2.5mA PFD FREQUENCY = 200kHz LOOP BANDWIDTH = 10kHz RES. BANDWIDTH = 1kHz VIDEO BANDWIDTH = 1kHz SWEEP = 1.3 SECONDS AVERAGES = 1
OUTPUT POWER (dB)
OUTPUT POWER (dB)
-30 -40 -50 -60 -70 -80 -90
-70.7dBc
04414-0-005
04414-0-007
1000
10k 100k FREQUENCY OFFSET (Hz)
1M
10M
-200kHz
-100kHz
2250MHz
100kHz
200kHz
Figure 5. VCO Phase Noise, 2250 MHz, 200 kHz PFD, 10 kHz Loop Bandwidth
Figure 8. Reference Spurs at 2250 MHz (200 kHz Channel Spacing, 10 kHz Loop Bandwidth)
0 -10 -20
OUTPUT POWER (dB)
-145 -150 -155 100
04414-0-006
-90 -1MHz -0.5MHz 2250MHz 0.5MHz 1MHz
1000
10k 100k FREQUENCY OFFSET (Hz)
1M
10M
Figure 6. VCO Phase Noise, 1125 MHz, Divide-by-2 Enabled 200 kHz PFD, 10 kHz Loop Bandwidth
Figure 9. Reference Spurs at 2250 MHz (1 MHz Channel Spacing, 25 kHz Loop Bandwidth)
Rev. 0 | Page 8 of 24
04414-0-009
-70 -75 -80 -85 -90 -95 -100 -105 -110 -115 -120 -125 -130 -135 -140
OUTPUT POWER (dB)
-30 -40 -50 -60 -70 -80
VDD = 3V, VVCO = 3V ICP = 2.5mA PFD FREQUENCY = 1MHz LOOP BANDWIDTH = 25kHz RES. BANDWIDTH = 10kHz VIDEO BANDWIDTH = 10kHz SWEEP = 1.9 SECONDS AVERAGES = 10
-84.8dBc/Hz
04414-0-008
ADF4360-1 CIRCUIT DESCRIPTION
REFERENCE INPUT SECTION
The reference input stage is shown in Figure 10. SW1 and SW2 are normally closed switches. SW3 is normally open. When power-down is initiated, SW3 is closed, and SW1 and SW2 are opened. This ensures that there is no loading of the REFIN pin on power-down.
POWER-DOWN CONTROL NC REFIN NC SW1 SW3 NO 100k TO R COUNTER BUFFER
04414-0-010
N = BP + A 13-BIT B COUNTER LOAD FROM VCO PRESCALER P/P+1 MODULUS CONTROL N DIVIDER LOAD 5-BIT A COUNTER
04414-0-011
TO PFD
SW2
Figure 11. A and B Counters
R COUNTER
The 14-bit R counter allows the input reference frequency to be divided down to produce the reference clock to the phase frequency detector (PFD). Division ratios from 1 to 16,383 are allowed.
Figure 10. Reference Input Stage
PRESCALER (P/P + 1)
The dual-modulus prescaler (P/P + 1), along with the A and B counters, enables the large division ratio, N, to be realized (N = BP + A). The dual-modulus prescaler, operating at CML levels, takes the clock from the VCO and divides it down to a manageable frequency for the CMOS A and B counters. The prescaler is programmable. It can be set in software to 8/9, 16/17, or 32/33 and is based on a synchronous 4/5 core. There is a minimum divide ratio possible for fully contiguous output frequencies; this minimum is determined by P, the prescaler value, and is given by (P2-P).
PFD AND CHARGE PUMP
The PFD takes inputs from the R counter and N counter (N = BP + A) and produces an output proportional to the phase and frequency difference between them. Figure 12 is a simplified schematic. The PFD includes a programmable delay element that controls the width of the antibacklash pulse. This pulse ensures that there is no dead zone in the PFD transfer function and minimizes phase noise and reference spurs. Two bits in the R counter latch, ABP2 and ABP1, control the width of the pulse (see Table 9).
VP UP CHARGE PUMP
A AND B COUNTERS
The A and B CMOS counters combine with the dual-modulus prescaler to allow a wide range division ratio in the PLL feedback counter. The counters are specified to work when the prescaler output is 300 MHz or less. Thus, with a VCO frequency of 2.5 GHz, a prescaler value of 16/17 is valid, but a value of 8/9 is not valid.
HI
D1 U1
Q1
R DIVIDER
CLR1
Pulse Swallow Function
The A and B counters, in conjunction with the dual-modulus prescaler, make it possible to generate output frequencies that are spaced only by the reference frequency divided by R. The VCO frequency equation is
fVCO = [(P x B ) + A] x f REFIN / R
N DIVIDER
PROGRAMMABLE DELAY
U3
CP
ABP1 CLR2 HI D2 U2 Q2
ABP2
DOWN
where: fVCO is the output frequency of the VCO. P is the preset modulus of the dual-modulus prescaler (8/9, 16/17, and so on). B is the preset divide ratio of the binary 13-bit counter (3 to 8191). A is the preset divide ratio of the binary 5-bit swallow counter (0 to 31). fREFIN is the external reference frequency oscillator.
R DIVIDER
CPGND
N DIVIDER
04414-0-012
CP OUTPUT
Figure 12. PFD Simplified Schematic and Timing (In Lock)
Rev. 0 | Page 9 of 24
ADF4360-1
MUXOUT AND LOCK DETECT
The output multiplexer on the ADF4360 family allows the user to access various internal points on the chip. The state of MUXOUT is controlled by M3, M2, and M1 in the function latch. The full truth table is shown on Table 7. Figure 13 shows the MUXOUT section in block diagram form. Table 5. C2 and C1 Truth Table
C2 0 0 1 1 Control Bits C1 0 1 0 1 Data Latch Control Latch R Counter N Counter (A and B) Test Modes Latch
Lock Detect
MUXOUT can be programmed for two types of lock detect: digital and analog. Digital lock detect is active high. When LDP in the R counter latch is set to 0, digital lock detect is set high when the phase error on three consecutive phase detector cycles is less than 15 ns. With LDP set to 1, five consecutive cycles of less than 15 ns phase error are required to set the lock detect. It will stay set high until a phase error of greater than 25 ns is detected on any subsequent PD cycle. The N-channel open-drain analog lock detect should be operated with an external pull-up resistor of 10 k nominal. When lock has been detected, this output will be high with narrow low-going pulses.
DVDD
VCO
The VCO core in the ADF4360 family uses eight overlapping bands, as shown in Figure 14, to allow a wide frequency range to be covered without a large VCO sensitivity (KV) and resultant poor phase noise and spurious performance. The correct band is chosen automatically by the band select logic at power-up or whenever the N counter latch is updated. It is important that the correct write sequence be followed at power-up. This sequence is 1. 2. 3. R counter latch Control latch N counter latch
ANALOG LOCK DETECT DIGITAL LOCK DETECT R COUNTER OUTPUT N COUNTER OUTPUT SDOUT
04414-0-013
During band select, which takes five PFD cycles, the VCO VTUNE is disconnected from the output of the loop filter and connected to an internal reference voltage.
MUXOUT
MUX
CONTROL
3.0 2.8 2.6 2.4 2.2 2.0
VOLTAGE (V)
DGND
1.8 1.6 1.4 1.2 1.0 0.8 0.4
04414-0-014
Figure 13. MUXOUT Circuit
INPUT SHIFT REGISTER
The ADF4360 family's digital section includes a 24-bit input shift register, a 14-bit R counter, and an 18-bit N counter, comprising of a 5-bit A counter and a 13-bit B counter. Data is clocked into the 24-bit shift register on each rising edge of CLK. The data is clocked in MSB first. Data is transferred from the shift register to one of four latches on the rising edge of LE. The destination latch is determined by the state of the two control bits (C2, C1) in the shift register. These are the two LSBs--DB1, DB0--as shown in Figure 2. The truth table for these bits is shown in Table 5. Table 6 shows a summary of how the latches are programmed. Note that the test modes latch is used for factory testing and should not be programmed by the user.
0.6 0.2
1850
1900
1950
2000
2050
2100
2150
2200
2250
2300
2350
2400
2450
2500
2550
FREQUENCY (MHz)
Figure 14. Frequency vs. VTUNE, ADF4360-1
The R counter output is used as the clock for the band select logic and should not exceed 1 MHz. A programmable divider is provided at the R counter input to allow division by 1, 2, 4, or 8 and is controlled by Bits BSC1 and BSC2 in the R counter latch. Where the required PFD frequency exceeds 1 MHz, the divide ratio should be set to allow enough time for correct band selection.
Rev. 0 | Page 10 of 24
2600
ADF4360-1
After band select, normal PLL action resumes. The nominal value of KV is 57 MHz/V or 28 MHZ/V if divide-by-2 operation has been selected (by programming DIV2 (DB22), high in the N counter latch). The ADF4360 family contains linearization circuitry to minimize any variation of the product of ICP and KV. The operating current in the VCO core is programmable in four steps: 5 mA, 10 mA, 15 mA, and 20 mA. This is controlled by Bits PC1 and PC2 in the control latch. If the outputs are used individually, the optimum output stage consists of a shunt inductor to VDD. Another feature of the ADF4360 family is that the supply current to the RF output stage is shut down until the part achieves lock as measured by the digital lock detect circuitry. This is enabled by the Mute-Till-Lock Detect (MTLD) bit in the control latch.
RFOUTA RFOUTB
OUTPUT STAGE
The RFOUTA and RFOUTB pins of the ADF4360 family are connected to the collectors of an NPN differential pair driven by buffered outputs of the VCO, as shown in Figure 15. To allow the user to optimize the power dissipation versus the output power requirements, the tail current of the differential pair is programmable via Bits PL1 and PL2 in the control latch. Four current levels may be set: 3.5 mA, 5 mA, 7.5 mA, and 11 mA. These levels give output power levels of -13 dBm, -10.5 dBm, -8 dBm, and -6 dBm, respectively, using a 50 resistor to VDD and ac coupling into a 50 load. Alternatively, both outputs can be combined in a 1 + 1:1 transformer or a 180 microstrip coupler (see the Output Matching section).
VCO BUFFER/ DIVIDE BY 2
Figure 15. Output Stage ADF4360-1
Rev. 0 | Page 11 of 24
04414-0-015
ADF4360-1
LATCH STRUCTURE
Table 6 shows the three on-chip latches for the ADF4360 family. The two LSBs decide which latch is programmed.
Table 6. Latch Structure
CONTROL LATCH
MUTE-TILLLD
COUNTER RESET
CP THREESTATE PHASE DETECTOR POLARITY
POWERDOWN 2
POWERDOWN 1
CP GAIN
PRESCALER VALUE
CURRENT SETTING 2
CURRENT SETTING 1
OUTPUT POWER LEVEL
MUXOUT CONTROL DB7 M3 DB6 M2 DB5 M1
CORE POWER LEVEL DB3 PC2 DB2
CONTROL BITS DB1 DB0
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 P2 P1 PD2 PD1 CPI6 CPI5 CP14 CPI3 CPI2 CPI1 PL2 PL1 MTLD CPG
DB9 CP
DB8 PDP
DB4 CR
PC1 C2 (0) C1 (0)
N COUNTER LATCH
DIVIDE-BY2 SELECT RESERVED
CP GAIN
DIVIDEBY-2
13-BIT B COUNTER
5-BIT A COUNTER
CONTROL BITS DB2 A1 DB1 DB0
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10
DIVSEL DIV2
DB9 B2
DB8 B1
DB7 RSV
DB6 A5
DB5 A4
DB4 A3
DB3 A2
CPG
B13
B12
B11
B10
B9
B8
B7
B6
B5
B4
B3
C2 (1) C1 (0)
R COUNTER LATCH
RESERVED RESERVED
BAND SELECT CLOCK
TEST MODE BIT LOCK DETECT PRECISION
ANTIBACKLASH PULSE WIDTH
14-BIT REFERENCE COUNTER
CONTROL BITS DB5 R4 DB4 R3 DB3 R2 DB2 R1 DB1 DB0
RSV
RSV BSC2 BSC1 TMB
LDP ABP2 ABP1
R14
R13
R12
R11
R10
R9
R8
R7
R6
R5
C2 (0) C1 (1)
Rev. 0 | Page 12 of 24
04414-0-026
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10
DB9
DB8
DB7
DB6
ADF4360-1
Table 7. Control Latch
MUTE-TILLLD COUNTER RESET
CP THREESTATE PHASE DETECTOR POLARITY
POWERDOWN 2
POWERDOWN 1
CP GAIN
PRESCALER VALUE
CURRENT SETTING 2
CURRENT SETTING 1
OUTPUT POWER LEVEL
MUXOUT CONTROL DB7 M3 DB6 M2 DB5 M1
CORE POWER LEVEL DB3 PC2 DB2
CONTROL BITS DB1 DB0
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 P2 P1 PD2 PD1 CPI6 CPI5 CP14 CPI3 CPI2 CPI1 PL2 PL1 MTLD CPG
DB9 CP
DB8 PDP
DB4 CR
PC1 C2 (0) C1 (0)
PC2 0 0 1 1
PC1 0 1 0 1
CORE POWER LEVEL 5mA 10mA 15mA 20mA
CPI6 CPI3 0 0 0 0 1 1 1 1
CPI5 CPI2 0 0 1 1 0 0 1 1
CPI4 CPI1 0 1 0 1 0 1 0 1
ICP(mA) 4.7k 0.31 0.62 0.93 1.25 1.56 1.87 2.18 2.50 CPG 0 1 MTLD 0 1
PDP 0 1
PHASE DETECTOR POLARITY NEGATIVE POSITIVE
CP 0 1
CHARGE PUMP OUTPUT NORMAL THREE-STATE
CR 0 1
COUNTER OPERATION NORMAL R, A, B COUNTERS HELD IN RESET
CP GAIN CURRENT SETTING 1 CURRENT SETTING 2
MUTE-TILL-LOCK DETECT DISABLED ENABLED M3 0 0 0 0 1 1 1 1 M2 0 0 1 1 0 0 1 1 M1 0 1 0 1 0 1 0 1 OUTPUT THREE-STATE OUTPUT DIGITAL LOCK DETECT (ACTIVE HIGH) N DIVIDER OUTPUT DVDD R DIVIDER OUTPUT N-CHANNEL OPEN-DRAIN LOCK DETECT SERIAL DATA OUTPUT DGND
PL2 0 0 1 1
PL1 0 1 0 1
OUTPUT POWER LEVEL CURRENT 3.5mA 5.0mA 7.5mA 11.0mA POWER INTO 50 (USING 50 TO VVCO) -6dBm -8dBm -10.5dBm -13.0dBm
CE PIN 0 1 1 1
PD2 X X 0 1
PD1 X 0 1 1
MODE ASYNCHRONOUS POWER-DOWN NORMAL OPERATION ASYNCHRONOUS POWER-DOWN SYNCHRONOUS POWER-DOWN
04414-0-016
P2 0 0 1 1
P1 0 1 0 1
PRESCALER VALUE 8/9 16/17 32/33 32/33
Rev. 0 | Page 13 of 24
ADF4360-1
Table 8. N Counter Latch
DIVIDE-BY2 SELECT RESERVED CP GAIN DIVIDEBY-2
13-BIT B COUNTER
5-BIT A COUNTER
CONTROL BITS DB2 A1 DB1 DB0
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10
DIVSEL DIV2
DB9 B2
DB8 B1
DB7 RSV
DB6 A5
DB5 A4
DB4 A3
DB3 A2
CPG
B13
B12
B11
B10
B9
B8
B7
B6
B5
B4
B3
C2 (1) C1 (0)
THIS BIT IS NOT USED BY THE DEVICE AND IS A DON'T CARE BIT.
A5 0 0 0 0 . . . 1 1 1 1
A4 0 0 0 0 . . . 1 1 1 1
.......... .......... .......... .......... .......... .......... .......... .......... .......... .......... .......... ..........
A2 0 0 1 1 . . . 0 0 1 1
A1 0 1 0 1 . . . 0 1 0 1
A COUNTER DIVIDE RATIO 0 1 2 3 . . . 28 29 30 31
B13 0 0 0 0 . . . 1 1 1 1
B12 0 0 0 0 . . . 1 1 1 1
B11 0 0 0 0 . . . 1 1 1 1
.......... .......... .......... .......... .......... .......... .......... .......... .......... .......... ..........
B3 0 0 0 1 . . . 1 1 1 1
B2 0 0 1 1 . . . 0 0 1 1
B1 0 1 0 1 . . . 0 1 0 1
B COUNTER DIVIDE RATIO NOT ALLOWED NOT ALLOWED NOT ALLOWED 3 . . . 8188 8189 8190 8191
F4 (FUNCTION LATCH) CP GAIN FASTLOCK ENABLE 0 0 0 1
OPERATION CHARGE PUMP CURRENT SETTING 1 IS PERMANENTLY USED CHARGE PUMP CURRENT SETTING 2 IS PERMANENTLY USED
DIV2 0 1
DIVIDE-BY-2 FUNDAMENTAL OUTPUT DIVIDE-BY-2
DIVSEL 0 1
DIVIDE-BY-2 SELECT (PRESCALER INPUT) FUNDAMENTAL OUTPUT SELECTED DIVIDE-BY-2 SELECTED
Rev. 0 | Page 14 of 24
04414-0-018
N = BP + A; P IS PRESCALER VALUE SET IN THE CONTROL LATCH. B MUST BE GREATER THAN OR EQUAL TO A. FOR CONTINUOUSLY ADJACENT VALUES OF (N x FREF), AT THE OUTPUT, NMIN IS (P2-P).
ADF4360-1
Table 9. R Counter Latch
RESERVED RESERVED
TEST MODE BIT LOCK DETECT PRECISION
BAND SELECT CLOCK
ANTIBACKLASH PULSE WIDTH
14-BIT REFERENCE COUNTER
CONTROL BITS DB5 R4 DB4 R3 DB3 R2 DB2 R1 DB1 DB0
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 RSV RSV BSC2 BSC1 TMB LDP ABP2 ABP1 R14 R13 R12 R11 R10 R9
DB9 R8
DB8 R7
DB7 R6
DB6 R5
C2 (0) C1 (1)
THESE BITS ARE NOT USED BY THE DEVICE AND ARE DON'T CARE BITS.
TEST MODE BIT SHOULD BE SET TO 0 FOR NORMAL OPERATION.
R14 0 0 0 0 . . . 1 1 1 1
R13 0 0 0 0 . . . 1 1 1 1
R12 0 0 0 0 . . . 1 1 1 1
.......... .......... .......... .......... .......... .......... .......... .......... .......... .......... ..........
R3 0 0 0 1 . . . 1 1 1 1
R2 0 1 1 0 . . . 0 0 1 1
R1 0 1 0 1 . . . 0 1 0 1
DIVIDE RATIO 1 2 3 4 . . . 16380 16381 16382 16383
ABP2 0 0 1 1
ABP1 0 1 0 1
ANTIBACKLASH PULSE WIDTH 3.0ns 1.3ns 6.0ns 3.0ns
LDP 0 1
LOCK DETECT PRECISION THREE CONSECUTIVE CYCLES OF PHASE DELAY LESS THAN 15ns MUST OCCURE BEFORE LOCK DETECT IS SET. FIVE CONSECUTIVE CYCLES OF PHASE DELAY LESS THAN 15ns MUST OCCUR BEFORE LOCK DETECT IS SET.
04414-0-017
BSC2 0 0 1 1
BSC1 0 1 0 1
BAND SELECT CLOCK DIVIDER 1 2 4 8
Rev. 0 | Page 15 of 24
ADF4360-1
CONTROL LATCH
With (C2, C1) = (0,0), the control latch is programmed. Table 7 shows the input data format for programming the control latch.
Charge Pump Currents
CPI3, CPI2, and CPI1 in the ADF4360 family determine Current Setting 1. CPI6, CPI5, and CPI4 determine Current Setting 2. See the truth table in Table 7.
Prescaler Value
In the ADF4360 family, P2 and P1 in the control latch set the prescaler values.
Power-Down
DB21 (PD2) and DB20 (PD1) provide programmable powerdown modes. In the programmed asynchronous power-down, the device powers down immediately after latching a 1 into Bit PD1, with the condition that PD2 has been loaded with a 0. In the programmed synchronous power-down, the device power-down is gated by the charge pump to prevent unwanted frequency jumps. Once the power-down is enabled by writing a 1 into Bit PD1 (on the condition that a 1 has also been loaded to PD2), the device will go into power-down on the second rising edge of the R counter output, after LE goes high. When the CE pin is low, the device is immediately disabled regardless of the state of PD1 or PD2. When a power-down is activated (either synchronous or asynchronous mode), the following events occur: * All active dc current paths are removed. * The R, N, and timeout counters are forced to their load state conditions. * The charge pump is forced into three-state mode. * The digital lock detect circuitry is reset. * The RF outputs are debiased to a high impedance state. * The reference input buffer circuitry is disabled. * The input register remains active and capable of loading and latching data.
Output Power Level
Bits PL1 and PL2 set the output power level of the VCO. See the truth table in Table 7.
Mute-Till-Lock Detect
DB11 of the control latch in the ADF4360 family is the Mute-TillLock Detect bit. This function, when enabled, ensures that the RF outputs are not switched on until the PLL is locked.
CP Gain
DB10 of the control latch in the ADF4360 family is the Charge Pump Gain bit. When it is programmed to a 1, Current Setting 2 is used. When it is programmed to a 0, Current Setting 1 is used.
Charge Pump Three-State
This bit puts the charge pump into three-state mode when programmed to a 1. It should be set to 0 for normal operation.
Phase Detector Polarity
The PDP bit in the ADF4360 family sets the phase detector polarity. The positive setting enabled by programming a 1 is used when using the on-chip VCO with a passive loop filter or with an active noninverting filter. It can also be set to 0. This is required if an active inverting loop filter is used.
MUXOUT Control
The on-chip multiplexer is controlled by M3, M2, and M1. See the truth table in Table 7.
Counter Reset
DB4 is the counter reset bit for the ADF4360 family. When this is 1, the R counter and the A, B counters are reset. For normal operation, this bit should be 0.
Core Power Level
PC1 and PC2 set the power level in the VCO core. The recommended setting is 15 mA. See the truth table in Table 7.
Rev. 0 | Page 16 of 24
ADF4360-1
N COUNTER LATCH
With (C2, C1) = (1, 0), the N counter latch is programmed. Table 8 shows the input data format for programming the N counter latch.
R COUNTER LATCH
With (C2, C1) = (0, 1), the R counter latch is programmed. Table 9 shows the input data format for programming the R counter latch.
A Counter Latch
A5 to A1 program the 5-bit A counter. The divide range is 0 (00000) to 31 (11111).
R Counter
R1 to R14 set the counter divide ratio. The divide range is 1 (00......001) to 16383 (111......111).
Reserved Bits
DB7 is a spare bit and has been designated as Reserved. It should be programmed to 0.
Antibacklash Pulse Width
DB16 and DB17 set the antibacklash pulse width.
B Counter Latch
B13 to B1 program the B counter. The divide range is 3 (00.....0011) to 8191 (11....111).
Lock Detect Precision
DB18 is the lock detect precision bit and sets the number of references cycles with less than 15 ns phase error for entering the locked state. With LDP at 1, five cycles are taken, and with LDP at 0, three cycles are taken.
Overall Divide Range
The overall divide range is defined by ((P x B) + A), where P is the prescaler value.
Test Mode Bit
DB19 is the test mode bit (TMB) and should be set to 0. With TMB = 0, the contents of the test mode latch are ignored and normal operation occurs as determined by the contents of the control latch, R counter latch, and N counter latch. Note that test modes are for factory testing only and should not be programmed by the user.
CP Gain
DB21 of the N counter latch in the ADF4360 family is the charge pump gain bit. When this is programmed to 1, Current Setting 2 is used. When programmed to 0, Current Setting 1 is used. This bit can also be programmed through DB10 of the control latch. The bit will always reflect the latest value written to it, whether this is through the control latch or the N counter latch.
Band Select Clock
These bits set a divider for the band select logic clock input. The output of the R counter is by default the value used to clock the band select logic, but if this value is too high (>1 MHz), a divider can be switched on to divide the R counter output to a smaller value (see Table 9).
Divide-by-2
DB22 is the divide-by-2 bit. When set to 1, the output divide-by-2 function is chosen. When it is set to 0, normal operation occurs.
Divide-by-2 Select
DB23 is the divide-by-2 select bit. When programmed to 1, the divide-by-2 output is selected as the prescaler input. When set to 0, the fundamental is used as the prescaler input. For example, using the output divide-by-2 feature and a PFD frequency of 200 kHz, the user will need a value of N = 12,000 to generate 1.1 GHz. With the divide-by-2 select bit high, the user may keep N = 6,000.
Reserved Bits
DB23 to DB22 are spare bits and have been designated as Reserved. They should be programmed to 0.
Rev. 0 | Page 17 of 24
ADF4360-1 APPLICATIONS
DIRECT CONVERSION MODULATOR
Direct conversion architectures are increasingly being used to implement base station transmitters. Figure 16 shows how ADI parts can be used to implement such a system. The circuit block diagram shows the AD9761 TxDAC(R) being used with the AD8349. The use of dual integrated DACs, such as the AD9761 with its specified 0.02 dB and 0.004 dB gain and offset matching characteristics, ensures minimum error contribution (over temperature) from this portion of the signal chain. The local oscillator is implemented using the ADF4360-1. The low-pass filter was designed using ADIsimPLL for a channel spacing of 1 MHz and an open-loop bandwidth of 25 kHz. The frequency range of the ADF4360-1 (2.05 GHz to 2.45 GHz) makes it ideally suited for implementation of a Bluetooth(R) transceiver. The LO ports of the AD8349 can be driven differentially from the complementary RFOUTA and RFOUTB outputs of the ADF4360-1. This gives a better performance than a singleended LO driver and eliminates the often necessary use of a balun to convert from a single-ended LO input to the more desirable differential LO inputs for the AD8349. The typical rms phase noise (100 Hz to 100 kHz) of the LO in this configuration is 1.09. The AD8349 accepts LO drive levels from -10 dBm to 0 dBm. The optimum LO power can be software programmed on the ADF4360-1, which allows levels from -13 dBm to -6 dBm from each output. The RF output is designed to drive a 50 load but must be accoupled, as shown in Figure 16. If the I and Q inputs are driven in quadrature by 2 V p-p signals, the resulting output power from the modulator will be approximately 2 dBm.
REFIO MODULATED DIGITAL DATA
IOUTA
AD9761 TxDAC
IOUTB
LOW-PASS FILTER
QOUTA FSADJ
2k
QOUTB
LOW-PASS FILTER
VVCO
VDD
LOCK DETECT VPS1 VPS2 100pF TO RF PA
10F
6
21
2
23
20
IBBP 3.9k 10nF 2k QBBP VVCO QBBN 47nH RFOUTA 4 47nH 1.5pF 3.9nH LOIP LOIN 1.5pF 3.9nH IBBN 330pF
FREFIN
VVCO DVDD AVDD CE MUXOUT VTUNE 7 14 CN CP 24 1nF 1nF 16 REFIN 51
17 18
680pF
CLK DATA LE CC RSET
AD8349
ADF4360-1
SPI COMPATIBLE SERIAL BUS
19 12
1nF 4.7k
13
1
3
8
9
10
11
22
15
Figure 16. Direct Conversion Modulator
Rev. 0 | Page 18 of 24
04414-0-019
CPGND
AGND
DGND RFOUTB 5
PHASE SPLITTER
ADF4360-1
FIXED FREQUENCY LO
Figure 17 shows the ADF4360-1 used as a fixed frequency LO at 2.2 GHz. The low-pass filter was designed using ADIsimPLL for a channel spacing of 8 MHz and an open-loop bandwidth of 40 kHz. The maximum PFD frequency of the ADF4360-1 is 8 MHz. Since using a larger PFD frequency allows users to use a smaller N, the in-band phase noise is reduced to as low as possible, -99 dBc/Hz. The 40 kHz bandwidth is chosen to be just greater than the point at which the open-loop phase noise of the VCO is -99 dBc/Hz, thus giving the best possible integrated noise. The typical rms phase noise (100 Hz to 100 kHz) of the LO in this configuration is 0.3. The reference frequency is from a 16 MHz TCXO from Fox, thus an R value of 2 is programmed. Taking into account the high PFD frequency and its effect on the band select logic, the band select clock divider is enabled. In this case, a value of 8 is chosen. A very simple pull-up resistor and dc blocking capacitor complete the RF output stage.
VVCO VVDD LOCK DETECT
ADuC812 Interface
Figure 18 shows the interface between the ADF4360 family and the ADuC812 MicroConverter(R) Since the ADuC812 is based on an 8051 core, this interface can be used with any 8051 based microcontroller. The MicroConverter is set up for SPI master mode with CPHA = 0. To initiate the operation, the I/O port driving LE is brought low. Each latch of the ADF4360 family needs a 24-bit word, which is accomplished by writing three 8bit bytes from the MicroConverter to the device. When the third byte has been written, the LE input should be brought high to complete the transfer.
SCLOCK MOSI
SCLK SDATA LE CE MUXOUT (Lock Detect)
ADuC812
I/O Ports
ADF4360-x
10F FOX 801BE-160 16MHz
6
21
2
23
20
VVCO DVDD AVDD CE MUXOUT VTUNE 7 14 CN CP 24 1nF 1nF 16 REFIN 51
17 CLK 18 DATA
Figure 18. ADuC812 to ADF4360-x Interface
15.0nF 620 VVCO 51 51
3.3nF
ADF4360-1
SPI COMPATIBLE SERIAL BUS
19 LE 12 CC
1nF 4.7k
13 RSET
100pF
RFOUTA 4 AGND
3 8 9 10 11 22
I/O port lines on the ADuC812 are also used to control powerdown (CE input) and detect lock (MUXOUT configured as lock detect and polled by the port input). When operating in the described mode, the maximum SCLOCK rate of the ADuC812 is 4 MHz. This means that the maximum rate at which the output frequency can be changed is 166 kHz.
CPGND
1
DGND RF OUTB 5
15
100pF
ADSP-2181 Interface
Figure 19 shows the interface between the ADF4360 family and the ADSP-21xx digital signal processor. The ADF4360 family needs a 24-bit serial word for each latch write. The easiest way to accomplish this using the ADSP-21xx family is to use the autobuffered transmit mode of operation with alternate framing. This provides a means for transmitting an entire block of serial data before an interrupt is generated.
Figure 17. Fixed Frequency LO
POWER-UP
After power-up, the part needs three writes for normal operation. The correct sequence is to the R counter latch, followed by the control latch, and N counter latch.
04414-0-023
SCLOCK MOSI TFS
SCLK SDATA LE CE MUXOUT (Lock Detect)
INTERFACING
The ADF4360 family has a simple SPI(R) compatible serial interface for writing to the device. CLK, DATA, and LE control the data transfer. When LE goes high, the 24 bits that have been clocked into the appropriate register on each rising edge of CLK will get transferred to the appropriate latch. See Figure 2 for the timing diagram and Table 5 for the latch truth table. The maximum allowable serial clock rate is 20 MHz. This means the maximum update rate possible is 833 kHz or one update every 1.2 microseconds. This is certainly more than adequate for systems that will have typical lock times in hundreds of microseconds.
ADSP-21xx
I/O Ports
ADF4360-x
Figure 19. ADSP-21xx to ADF4360-x Interface
Set up the word length for 8 bits and use three memory locations for each 24-bit word. To program each 24-bit latch, store the 8-bit bytes, enable the autobuffered mode, and write to the transmit register of the DSP. This last operation initiates the autobuffer transfer.
Rev. 0 | Page 19 of 24
04414-0-025
04414-0-024
ADF4360-1
PCB DESIGN GUIDELINES FOR CHIP-SCALE PACKAGE
The leads on the chip-scale package (CP-24) are rectangular. The printed circuit board pad for these should be 0.1 mm longer than the package lead length and 0.05 mm wider than the package lead width. The lead should be centered on the pad to ensure that the solder joint size is maximized. The bottom of the chip-scale package has a central thermal pad. The thermal pad on the printed circuit board should be at least as large as this exposed pad. On the printed circuit board, there should be a clearance of at least 0.25 mm between the thermal pad and the inner edges of the pad pattern to ensure that shorting is avoided. Thermal vias may be used on the printed circuit board thermal pad to improve thermal performance of the package. If vias are used, they should be incorporated in the thermal pad at 1.2 mm pitch grid. The via diameter should be between 0.3 mm and 0.33 mm, and the via barrel should be plated with 1 ounce of copper to plug the via. The user should connect the printed circuit thermal pad to AGND. This is internally connected to AGND. Experiments have shown that Figure 21 provides an excellent match to 50 over the operating range of the ADF4360-1. This gives approximately -4 dBm output power across the frequency range of the ADF4360-1. Both single-ended architectures can be examined using the EVAL_ADF4360-1EB1 evaluation board.
VVCO 47nH 1.5pF 3.9nH 50
04414-0-021
RFOUT
Figure 21. Optimum ADF4360-1 Output Stage
If the user does not need the differential outputs available on the ADF4360, the user may either terminate the unused output or combine both outputs using a balun. The circuit in Figure 22 shows how best to combine the outputs.
VVCO
1nH RFOUTA
3.6nH 1.5pF 3.6nH
47nH 10pF 50
04414-0-022
OUTPUT MATCHING
There are a number of ways to match the output of the ADF4360-1 for optimum operation; the most basic is to use a 50 resistor to VVCO. A dc bypass capacitor of 100 pF is connected in series as shown Figure 20. Because the resistor is not frequency dependent, this provides a good broadband match. The output power in the circuit below typically gives-6 dBm output power into a 50 load.
VVCO 51 100pF 50
04414-0-020
RFOUTB
1nH 1.5pF
Figure 22. Balun for Combining ADF4360-1 RF Outputs
RFOUT
Figure 20. Simple ADF4360-1 Output Stage
A better solution is to use a shunt inductor (acting as an RF choke) to VVCO. This gives a better match and hence more output power. Additionally, a series inductor is added after the dc bypass capacitor to provide a resonant LC circuit. This tunes the oscillator output and provides approximately 10 dB additional rejection of the second harmonic. The shunt inductor needs to be a relatively high value (>40 nH).
The circuit in Figure 22 is a lumped lattice type LC balun. It is designed for a center frequency of 2.2 GHz and outputs 1.0 dBm at this frequency. The series 1 nH inductor is used to tune out any parasitic capacitance due to the board layout from each input, and the remainder of the circuit is used to shift the output of one RF input by 90 and the second by -90, thus combining the two. The action of the 3.6 nH inductor and the 1.5 pF capacitor accomplish this. The 47 nH is used to provide an RF choke in order to feed the supply voltage, and the 10 pF capacitor provides the necessary dc block. To ensure good RF performance, the circuits in Figure 21 and Figure 22 were implemented with Coilcraft 0402/0603 inductors and AVX 0402 thin-film capacitors. Alternatively, instead of the LC balun shown above, both outputs may be combined using a 180 rat-race coupler.
Rev. 0 | Page 20 of 24
ADF4360-1 OUTLINE DIMENSIONS
4.00 BSC SQ 0.60 MAX 0.60 MAX 0.50 BSC 0.50 0.40 0.30 1.00 0.85 0.80 12 MAX 0.80 MAX 0.65 TYP
19 18 24 1
PIN 1 INDICATOR 2.25 2.10 SQ 1.95
6
PIN 1 INDICATOR
TOP VIEW
3.75 BSC SQ
BOTTOM VIEW
13 12 7
0.25 MIN 2.50 REF
0.05 MAX 0.02 NOM 0.20 REF COPLANARITY 0.08
SEATING PLANE
0.30 0.23 0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2
Figure 23. 24-Lead Lead Frame Chip-Scale Package [LFCSP] (CP-24) Dimensions shown in millimeters
ORDERING GUIDE
Model ADF4360-1BCP ADF4360-1BCPRL ADF4360-1BCPRL7 EVAL-ADF4360-1EB1 Temperature Range -40C to +85C -40C to +85C -40C to +85C Frequency Range 2050 MHz to 2450 MHz 2050 MHz to 2450 MHz 2050 MHz to 2450 MHz Package Option CP-24 CP-24 CP-24 Evaluation Board
Rev. 0 | Page 21 of 24
ADF4360-1 NOTES
Rev. 0 | Page 22 of 24
ADF4360-1 NOTES
Rev. 0 | Page 23 of 24
ADF4360-1 NOTES
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
(c) 2003 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. C04414-0-8/03(0)
Rev. 0 | Page 24 of 24


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